National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development
The NAPMP seeks to drive U.S. leadership in advanced packaging and provide the technology and skilled workforce needed for packaging manufacturing in the United States. Within a decade, NAPMP-funded activities, coupled with CHIPS manufacturing incentives, will establish a vibrant, self sustaining, profitable, domestic advanced packaging industry where advanced-node chips manufactured in the United States and abroad can be packaged in appropriate volumes within the United States and innovative designs and architectures are enabled through leading-edge packaging capabilities. In combination with other CHIPS for America education and workforce efforts, NAPMP-funded activities will produce the diverse and capable workforce needed for the success of the domestic packaging sector. The objective of this NOFO is to enable, through R&D, innovative new advanced packaging flows suitable for adoption by U.S. industry
*Full applications will be due 60 days from the date of invitation.